The exposed and developed substrates can then either be coated (see thin film deposition) or etched with the following technologies:
- isotropic and anisotropic chemical wet etching,
- isotropic and anisotropic reactive ion etching,
- areal argon ion milling, or
- focused ion beam etching (Helium, Neon or Gallium).
In addition, structures made of platinum, tungsten or silicon dioxide can also be written directly onto substrates with a resolution of up to a few nanometers by means of
- electron or ion beam induced deposition
