In spin coating, a liquid polymer is usually applied to a substrate and a thin film is produced by spinning off the excess liquid. In a subsequent softbake step, the solvent remaining in the film is completely expelled. The resulting layer thickness depends mainly on the viscosity of the polymer and the number of revolutions per minute.
This Spin Coater is mainly used for coating with photo and ebeam resists. Small pieces of siezes from 5x5 mm² up to whole 6" wafers can be coated. The number of revolutions can be steplessly adjusted from 200 up to 8000 rpm. Substrates can be baked or dehydrated at up to 450°C on a separate hotplate.